Responsibilities:Develop and implement strategic sales plans to achieve revenue targets and expand market share within the assigned customers, in line with overall company goals and objectivesUtilize technical and market knowledge to identify and pursue new business opportunities, including new markets, customers, and applications. Build strong design win pipeline for future revenue stream. Manage the sales process for new accounts from initial contact through the entire processBuild and maintain strong customer relationships with key decision makers and influencers within the target accounts. Be the main contact point between the company and customers in all sales-related matters. Have deep knowledge of customer’s business and product requirements, and tailor solutions to meet customer needsConduct regular meetings, updates, and presentations to educate customers on the value proposition of our products and services. Participate in regular business reviews (e.g. QBRs) to assess sales and operations trends and identify opportunities for growth and improvementsIntegrates with cross-functional teams, including engineering, marketing, operations, and customer service to ensure that the company deliver the most coherent, best in class solutions to the customersStay abreast of market trends, competitive landscape, and emerging technologies in the semiconductor industryAnalyze sales data and market feedback to continuously improve sales strategies and tactics. Provides information on customer needs, volume potential, pricing, and competition. Provide feedback from the field to inform product direction and roadmap decisionsTracks sales activities, pipeline and forecasts, with the help of CEM. Prepare and present sales forecasts, reports, and presentations to senior management. Regularly provides information to management on accounts and business activitiesNegotiate contracts, pricing, and terms with customers to maximize profitability and mitigate riskMay provide guidance to other sales team members including TPMs and AMs to drive performance and meet sales objectivesOwns the customer responsibilities to drive and ensure “quality” in all aspects of customer support (logistics, operations, technology). Maps out customer relationships with activities to drive all levels of relationship toward mutual successHas clear understanding of TAM / SAM / SOM at the specific customer, with continued initiatives to grow the overall customer revenueDrive to achieve annual revenue targets and defined KPI’sEnsure all new initiatives to grow SAM regionally or at specific customer has been reviewed at appropriate NPI forum, with appropriate resource allocation in order to be successfulWillingness to travel to the customers and factory locations to improve / strengthen the sales relationship
Requirements:Degree or equivalent experience is requiredMinimum 5-10 years of relevant experience in the semiconductor industry or related fieldSound knowledge of the company’s productsA self-motivated, go-and-get approach and the will to winStrong presentation, sales, negotiation, and influencing skills. Proven ability to negotiate and close complex sales agreements with customersSuperior interpersonal communication skills and the ability to build strong relationships with senior management, both internally and externallyStrategic thinker with the ability to develop and execute sales plans that align with business objectivesStrong analytical skills with the ability to interpret sales data and market trends to make informed decisions.Proficiency in Microsoft Office suite and CRM software
Responsibilities:Develop and optimize ball drop process parameters such as flux printing, ball placement, and reflow profile. Define and maintain process windows for various ball sizes and pitchesImprove yield, reduce defects, and enhance throughputSupport new device qualification and technology transfersCreate recipes for new devicesTroubleshoot ball‑related defects including missing balls, ball shift/misalignment, ball bridging, non‑wet/weak attach, and voiding issuesPerform root cause analysis (8D, Fishbone, 5‑Why), monitor SPC charts, and control process variationQualify new ball drop tools and support equipment buy‑offsOptimize machine settings including placement accuracy, vacuum control, and alignment systemsWork with suppliers on solder ball materials (composition, diameter tolerance, oxidation control)Ensure proper flux type selection and usageHandle documentation and reporting tasks such as creating SOPs, process specifications, and FMEAPrepare engineering reports and conduct yield analysisSupport customer and internal audits
Requirements:Degree in Engineering (Electronics, Chemical, Materials, Mechanical, or related field)Min 3 years’ experience in semiconductor assembly, preferably WLCSPStrong knowledge of Solder ball attach process, Flux printing and reflow, DOE and statistical analysis, SPC and yield improvement methodologyUnderstanding of IMC formation (Cu-Sn intermetallic), Surface finish (UBM, Cu pillar, ENIG). Reflow thermal profilingProficiency in MP / Minitab, SPC software, MS Office toolsStrong problem-solving skills. Good communication and cross-functional collaborationDetail-oriented with strong analytical mindset
Responsibilities:Serve as the primary owner of FabGuard FDC systems across all fab tools and processesDefine, maintain, and enforce standard practices for FDC setup, alarm configuration, and data handlingAct as the go-to expert for PEs and EEs on FDC usage, including parameter selection, data trimming, framing, and report creationLead FDC system upgrades, maintenance schedules, and ensure minimal production disruption. Ensure all FDC configurations are properly documented and backed upAssist PEs/EEs in interpreting FDC data for root cause analysis of process excursionsIdentify trends, anomalies, and recurring faults to support yield and equipment performance improvementsCollaborate with process, equipment, IT teams, and vendors to optimize FDC use and serve as liaison for FDC-related issuesTrain and mentor engineers on FDC system usage, best practices, and troubleshootingParticipate in project teams, audits, and continuous improvement initiatives
Requirements:Degree in Engineering (Electrical, Electronics, Mechanical, Industrial, or related fields)5–10 years semiconductor experience with hands-on exposure to FDC, MES, or APC systemsFamiliarity with wafer bumping, RDL, or advanced packaging processes preferredExperience in troubleshooting and process improvement using FDC dataExpertise in FDC systems, data analysis, and alarm managementKnowledge of MES, SPC, SQL databases, and basic scripting (Python, VBA) desirableStrong analytical, problem-solving, and cross-functional collaboration skills
Responsibilities:Identify risk areas and ensure risk control plans are deployed for excursion-free launchDeploy control plans for smooth production flowsConduct qualification and validation tests for new materialsManage quality system certification Evaluate calibration and measurement analysis systems for improvementsConduct audit validation and drive systemic solutions with team membersManage quality planning to complement quality systems. Drive compliance in quality policies and proceduresDevelop, drive, and communicate quality systems to ensure operations meet both internal and external parties' quality requirementsFormulate and implement quality project plans in collaboration with stakeholders, driving improvement activities to achieve organizational goalsIdentify system gaps and enhancements in the quality management systemsLead cross-functional teams in continuous improvement projectsDevelop on-the-job training programs and workplace learning plansCoach and build team leaders’ capabilitiesLead team leaders in formulating business unit strategies and operational plans
Requirements:Degree in Engineering or a related disciplineMinimum 3 years of experience in the semiconductor industry, with exposure to operations support in high-volume manufacturingStrong knowledge of quality systems, audits, and continuous improvement methodologiesGood communication skills and ability to work effectively with cross-functional teams
Responsibilities:Fast response of any lithography process or quality related issue, troubleshoot and resolve the issuesOwner of PMFEA, OCAP and WI/ SOP for documentation and updatePropose and lead process CIPs for chronic issue resolvingPlan and conduct new process/ package development and evaluationsPerform process margin study to determine the process capability of new process/ packageLead all the evaluation lots and report the evaluation results in a timely mannerProvide technical training and support to troubleshoot process issues encountered in manufacturing lineWork closely with other departments to ensure successful implementation of new process/ package
Requirements:Degree in Engineering or ScienceAt least 2-3 years of experience in the semiconductor manufacturing industry with exposure to dry process such as photolithography/ plasma, sputtering; or wet process such as electrochemical plating, wet etching etcStatistical (SPC) and analytical skills (problem solving methodologies) are essentialFamiliar with using MS Excel and PowerPoint. Prior experience in using CAD and statistical software will be an added advantage
Responsibilities:Responsible for laser groove process qualification, implementation, procedure generation and control. Coordinates with Manufacturing, QA, Planning and NPI on Quality and process issues. Maintain a good production performance such as yield, quality and provide analysis and solutions to production quality and process related issuesResponsible for Monitor and sustain Engineering/Qualification/Pre-production/Ramp-up devices to ensure parts have met quality requirements and ship in timeHands-on process during Qualification/Evaluation/FAI of new devices in Laser Groove to ensure customer process requirement are being metDevelop evaluation, characterization plans for new products and conducts failure analysis and process troubleshootingResponsible for qualification of machine, materials and tools for new products to ensure its compatibility with the existing standard process flowLiaise with inter-department, customers and potential customers on establishment and improvement of process, direct/in-direct material and equipment capabilitiesAbility to perform cross functional projects to drive improvement
Requirements:Degree in Engineering or related field3 years’ experience in semiconductor manufacturing or process engineeringGood communication, analytical and problem‑solving skills
Responsibilities:Technical project leader with cross functional teamOversee new product development per required schedule and budget.Ensure smooth project execution till pre-production stage.Work closely and independently with internal/external customers and suppliers to evaluate new enabling process, materials and equipment through regular progress and status update.Enable technology offload to assembly and ensure system requirements and customers’ needs are met.Provide technical advice and consultation to secure business & strengthen competitiveness. Contribute actively in promoting the company’s technological capability through customers’ presentation.Set, align and drive goals and strategies of department. Identify and propose new package and process development for the Company’s roadmap.Manage resources efficiently to fulfil project/ program requirements as well as overall group performance and synergy. Provide coaching and non-technical assistance to remove barriers/ obstacles to achieve department goals.
Requirements:Minimum a Bachelor’s degree in Electronics, Mechatronics, Engineering, Material science or any related semiconductor manufacturing discipline.At least 10 years’ experience in Wafer Bumping Process Development.Proficient in wafer bumping processes, including PVD, Lithography, Plating, Ball drop and WLCSP backend processes. Strong analytical skills with hands-on experience in failure analysis and data analysis tools.Proven leadership capability in driving new projects and technologies from planning and design through qualification and production ramp-up, in collaboration with cross functional teams. Excellent communication skills with the ability to effectively engage both internal and external stakeholders. Knowledge of Fan Out technology and assembly process is an added advantage.
Responsibilities:Review, plan, manage and improve cost effective preventive/predictive maintenance programs for facilities system, ensuring good system reliability and optimum efficiencyRespond to feedback/issues and troubleshoot issues to restore normal operationsPerform root cause analysis and implement action plans to prevent recurrenceReview and evaluate system capacity and performance to recommend/implement continuous improvement plansPerform analysis of utilities consumption for early detection of anomalies and collaborate with Sustainability Team/Operation for Sustainability Initiatives/Projects to reduce the consumptionReview, maintain and update procedures/specification in Global Documentation Management SystemMaintain proper records of maintenance, drawings, plant histories, and other auditable documentationsReview and manage inventories of appropriate spares, consumables, and other resources necessary for the day-to-day operationSupport planning, design, and management of expansion/upgrading/improvement projectsSupport audits (i.e. ISO, IATF, RBA, VDA, EAL6, Customers, etc) and ensure its complianceProvide guidance to duty staffs and knowledge sharing with fellow colleagues to continue strengthen the operationResources management (i.e. energy, water, gases, etc) including analysis & submission of sustainability data/performance as well as Energy Conservation Act (ECA) & Water Efficiency Management Plan (WEMP) submissions to ensure compliance to relevant authorities’ requirements
Requirements:Degree in Mechanical Engineering, Electrical Engineering or a related fieldMinimum of 3 years of relevant experience in the manufacturing industry preferredACMV, DI Water, CDA, Vacuum, Gases, WWTP, Electrical System experience would be an advantageCertified Singapore Certified Energy Manager (SCEM) will be an added advantageGood communication skills and a team player
Responsibilities:Responsible for Production Planning/ SchedulingResponsible for recovery planning to mitigate impact of line performance issue to customerMonitor forecasted plan, track and report on machine utilization and performance and drive operations to meet output and shipments and revenue to ensure timely delivery to customers and meet KPI such as cycle time and on time deliveryProvides input to Customer Service department in term of forecast loading, revenue attainment, shipment and performanceCollaborate with cross functional teams to ensure that customer requirements can be met for current and future demandResponsible for documentation of Processes and Procedure for continuity and training purposesContinuous Improvement and InnovationAddress issues and exercise judgement within broadly defined practices and approaches to solve complex problems on production performance, outputs and requirementParticipate in all continuous improvement and/or automation projects to fully optimize the manufacturing process, improving CT, improving flow and cost effectiveness
Requirements:Degree in any disciplineMinimum 3 - 5 years of relevant experience in planning, preferably in semiconductor industryGood communication and interpersonal skillsAble to work in a dynamic and fast moving environment
