About the jobAt UMC, your career is built on solid ground. Through exposure to the world’s leading semiconductor technologies, guided mentorship, and a culture built on growth and collaboration, we help you forge a strong foundation for your future.With the expansion of our new Fab in Singapore, you’ll be part of a next-generation engineering hub, designed to empower local talent and lead semiconductor innovation in the region.With us, you can expect at UMC:· Structured Development: Hands-on training, mentorship, and clear pathways to build your core skills.· Front-Row Tech Access: Work with cutting-edge tools that push industries forward.· Heart-Fueled Innovation: Thrive in a team-first environment that values your growth and purpose.
Responsibilities:Handle customer complaints, returns, and improvement requests; monitor progress and ensure efficient resolution.Coordinate customer audits, QA visits, and surveys, including follow-up activities to address findings.Manage customer requests and maintain relevant customer satisfaction metrics, representing the company’s technical excellence and reliability.Collaborate with cross-functional teams to resolve quality issues and meet customer requirements, driving product quality improvements.
Requirements:Minimum Bachelor's degree in Electronics Engineering, Electrical Engineering, Material Science, Chemistry and Physics.Basic understanding of semiconductor technology.>3 years’ relevant experience in module process/integration and/or quality field handling customer.Knowledge of problem solving (8D methodology), statistical techniques, production part approval process (PPAP) and planning/project management is an advantageKnowledge of ISO9001/ISO/TS16949 or VDA6.3 standards and audit handling/experience is preferredExcellent communication and negotiation skills; capable of effective collaboration with external partners and customers.Proficiency in presentation skills
About the job
At UMC, your growth is engineered for resilience. We combine long-term stability with non-linear, adaptable career paths, giving you the opportunity to make real impact, while growing with purpose.
With our newly expanded Fab and facilities in Singapore, we’re investing in a future-ready workforce equipped to lead in the world’s most advanced manufacturing environments.
With us, you can expect at UMC:Career Resilience: Be part of a stable, values-led company with a track record of supporting our people, even in uncertain timesGrowth that Fits You: Explore flexible development paths, cross-functional opportunities, and internal mobilityMeaningful Impact: Help deliver technologies that power everything from AI to smart mobility and sustainable innovation
Main ResponsibilitiesResponsible for Equipment Uptime, Productivity and CIP.Work in a cleanroom environment for long hours.In-charge of PM planning, Equipment Maintenance, and Parts Management.Co-work with Engineer to resolve equipment/line issues.To improve and enhance machine performance and upgrade machine capability
You are someone who brings precision, resilience, and purpose to everything you do. You thrive in a collaborative, tech-forward environment and are ready to lead work that drives impact and transformation.
We’re looking for someone with:Diploma in Electrical, Electronics, Mechanical, Materials or Engineering related fieldExcellent Communication & Inter-Personal skillAbility to work under pressure & in a Dynamic EnvironmentMust be willing to perform 12 hours night shift workMust Possess Positive attitude, Self Starter & Team PlayerCandidates without experience are welcome to apply
Ready to Precision-Engineer Your Future?Whether you're seeking your next challenge or ready to lead meaningful innovation, UMC is where you can shape what comes next.Lead What’s Next. Apply Now.
About United Microelectronics Corporation
United Microelectronics Corporation (UMC) is a leading global semiconductor foundry with over 40 years of innovation powering technologies across AI, automotive, consumer electronics, connectivity, and IoT. As one of the industry’s most established players, we enable breakthrough technologies through precision-engineered semiconductor manufacturing for customers across every major sector of the electronics world.
Headquartered in Taiwan, UMC has been present in Singapore since 2004 and continues to invest in local talent, technology, and advanced manufacturing. Our recent Fab expansion reflects our long-term commitment to building Singapore as a key hub for semiconductor innovation, and to creating stable, meaningful careers through innovation, teamwork, and progress.
Join a team where your expertise powers real-world innovation. At UMC, you’ll find long-term stability, growth that adapts to your path, and work that drives impact, right down to the nanometre.
About the job
At UMC, your career is built on solid ground. Through exposure to the world’s leading semiconductor technologies, guided mentorship, and a culture built on growth and collaboration, we help you forge a strong foundation for your future. With the expansion of our new Fab in Singapore, you’ll be part of a next-generation engineering hub, designed to empower local talent and lead semiconductor innovation in the region.
At UMC, you can expect:Structured Development: Hands-on training, mentorship, and clear pathways to build your core skillsFront-Row Tech Access: Work with cutting-edge tools that push industries forwardHeart-Fuelled Innovation: Thrive in a team-first environment that values your growth and purpose
Main ResponsibilitiesYou’ll play a hands-on role in building foundational technologies that power everyday innovation, from smart devices to sustainable solutions. As a Process Integration Engineer in our team, you will:Support new customer product introduction into the FAB, ensuring smooth pilot and tape-out processes.Improve yield and ensure stability in in-line, wafer acceptance test (WAT), and chip probe (CP) results.Define and implement standard operating procedures (SOPs) for production.Collaborate with module engineers to resolve production issues related to yield, reliability, and in-line parameters.Work cross-functionally to develop customized process flows that meet customer need.
You’ll play a hands-on role in building foundational technologies that power everyday innovation, from smart devices to sustainable solutions.
You are someone who thrives in a fast-paced, precision-driven environment. You are collaborative, detail-oriented and ready to take on challenges that help shape the future.
We’re looking for someone with:A bachelor’s degree in Electronics, Electrical & Electronics, Physics, or Materials Science.Academic background in semiconductor devices, wafer fabrication or chip technology.Strong communication and time management skills, with high level of commitment to learning through hands-on-experience.Prior exposure to foundry environments or projects is an advantage.
Ready to Precision-Engineer Your Future?Whether you’re looking for your first role or your next career move, UMC is where your future can take shape.Step into your future with us. Apply Now.
About United Microelectronics Corporation
United Microelectronics Corporation (UMC) is a leading global semiconductor foundry with over 40 years of innovation powering technologies across AI, automotive, consumer electronics, connectivity, and IoT. As one of the industry’s most established players, we enable breakthrough technologies through precision-engineered semiconductor manufacturing for customers across every major sector of the electronics world.
Headquartered in Taiwan, UMC has been present in Singapore since 2004 and continues to invest in local talent, technology, and advanced manufacturing. Our recent Fab expansion reflects our long-term commitment to building Singapore as a key hub for semiconductor innovation, and to creating stable, meaningful careers through innovation, teamwork, and progress.
Join a team that invests in your future from day one. With best-in-class training, hands-on experience and access to cutting-edge tools, UMC equips you to lead tomorrow’s tech landscape, right down to the nanometre.
Job Responsibility:Work closely with foundry device and process development teams to design RF functional blocks like PA, LNA and RF-Switches to validate RF-SOI technologiesWork closely with foundry model and design enablement team to create application oriented/ design friendly/ competitive model, process design kit, and design flowTo conduct device pcell design, test case creation and validation. To work with modeling & PDK team for design enablement, model validation and pcell improvementTo interface with customers for RF front end design queries and debug.
Required Skills:Solid knowledge in RF device design and physics, especially: Deep understanding RF device/ circuits characteristics Hands-on experience in one of below fields are preferred:RF front end circuit design in bulk Si, RFSOI, SiGeEM simulation (chip or package level) and design flowThermal, stress simulation (chip or package level) and design flowStrong communication and interpersonal skills.Devoted professional: you are diligent and deliberate in your work, leveraging your expertise to deliver results without ego.Avid Learner: you thrive with challenges, seek continuous growth and improvement, and seek data to prove your hypotheses.
Qualification:Master or Ph. D. in electrical engineering, microelectronics or communications with 2+ years of experience in semiconductor industrial or lab experience.Lab or industrial experience in RF design is preferred.English Language level: good English oral and writing skill.
Job ResponsibilityRF/mm-wave Device Characterization; Measurement, Data Analysis and Reporting.Test Automation and Scripting.Assist in Device Layout Design.Follow and enforce test Laboratory practices.Test equipment vendor liaising and follow ups.
Capability2-3 years of RF measurement experience preffered. Training will be provided for Fresh graduates.Programming / test automation skillsGood communication and team work skills.Self-motived and avid learner.
QualificationBachelor/Master’s degree in a relevant discipline.Experience in semiconductor device Testing /Characterization /Test-Scripting in any Fab and/or design company preffered.Good proficiency in oral and written English.Proven track-record of collaboration and team work
Job Responsibilities:Develop novel BCD platform devices.Conduct TCAD device simulations and deck calibration.Design, analyze, and layout device test keys.Perform device bench testing including DC/HV/reliability testing and characterization.Fine-tune devices to ensure on-time delivery and successful reliability qualification.
Required Capabilities:Solid semiconductor device physics and analysis skill, with a focus on bipolar and power devices.Experience in BCD (Bipolar-CMOS-DMOS) device development and characterization is preferred.Hands on experience in TCAD simulation, calibration, layout, and power device bench testing is advantageous.Good communication and teamwork skills to collaborate effectively with the team.Self-motivated and avid learner.
Qualifications:Preferred Master's or Ph.D. degree in Physics or Electrical Engineering.Relevant working experience in BCD development is preferred.Proficient in both oral and written English.
About the job
At UMC, your growth is engineered for resilience. We combine long-term stability with non-linear, adaptable career paths, giving you the opportunity to make real impact, while growing with purpose.
With our newly expanded Fab and facilities in Singapore, we’re investing in a future-ready workforce equipped to lead in the world’s most advanced manufacturing environments.
With us, you can expect at UMC:Career Resilience: Be part of a stable, values-led company with a track record of supporting our people, even in uncertain times.Growth that Fits You: Explore flexible development paths, cross-functional opportunities, and internal mobility.Meaningful Impact: Help deliver technologies that power everything from AI to smart mobility and sustainable innovation.
Main ResponsibilitiesAs a Senior Technology Development Integration Engineer, you will:Lead the development of advanced RFSOI and RFSOI-3DIC technology platforms for next-generation communication solutions.Design and qualify new process modules and RF device structures to enhance platform capability and performance.Establish and validate new process flows in Design-Start Modules (DSM) for customer-specific applications.Collaborate closely with customers on new product verification, process customization, and technical alignment.Coordinate cross-functional activities from design to qualification, ensuring robust integration and yield performance.You’ll lead work that powers the day-to-day technologies behind modern life, from mobility and connectivity to smart systems and sustainable design.
You are someone who brings precision, resilience, and purpose to everything you do. You thrive in a collaborative, tech-forward environment and are ready to lead work that drives impact and transformation.
We’re looking for someone with:A Bachelor’s, Master’s, or PhD in Electrical Engineering, Electronics, or Physics.Experience in semiconductor process integration, ideally with a focus on RF device or RFSOI development.Strong skills in device characterization, process qualification, and integration debugging.Knowledge of module development and semiconductor tooling is an advantage.Excellent communication skills with the ability to collaborate effectively across teams and with customers.A self-motivated, detail-oriented mindset with a passion for learning and continuous improvement
Ready to Precision-Engineer Your Future?Whether you're seeking your next challenge or ready to lead meaningful innovation, UMC is where you can shape what comes next.Lead What’s Next. Apply Now.
About United Microelectronics Corporation
United Microelectronics Corporation (UMC) is a leading global semiconductor foundry with over 40 years of innovation powering technologies across AI, automotive, consumer electronics, connectivity, and IoT. As one of the industry’s most established players, we enable breakthrough technologies through precision-engineered semiconductor manufacturing for customers across every major sector of the electronics world.
Headquartered in Taiwan, UMC has been present in Singapore since 2004 and continues to invest in local talent, technology, and advanced manufacturing. Our recent Fab expansion reflects our long-term commitment to building Singapore as a key hub for semiconductor innovation, and to creating stable, meaningful careers through innovation, teamwork, and progress.
Join a team where your expertise powers real-world innovation. At UMC, you’ll find long-term stability, growth that adapts to your path, and work that drives impact, right down to the nanometre.
About the job
At UMC, your growth is engineered for resilience. We combine long-term stability with non-linear, adaptable career paths, giving you the opportunity to make real impact, while growing with purpose.
With our newly expanded Fab and facilities in Singapore, we’re investing in a future-ready workforce equipped to lead in the world’s most advanced manufacturing environments.
With us, you can expect at UMC:Career Resilience: Be part of a stable, values-led company with a track record of supporting our people, even in uncertain timesGrowth that Fits You: Explore flexible development paths, cross-functional opportunities, and internal mobilityMeaningful Impact: Help deliver technologies that power everything from AI to smart mobility and sustainable innovation
Main ResponsibilitiesYou’ll lead work that powers the day-to-day technologies behind modern life, from mobility and connectivity to smart systems and sustainable design. As a Technology Development Engineer (Device/TCAD) in our team, you will:Conduct TCAD-based research and simulations to explore novel device concepts and architectures.Develop, document and calibrate TCAD simulation decks in collaboration with cross-functional project teams.Execute TCAD design of experiments (DOE) and generate tuning decks to support device optimisation.Design test keys and layout structures for silicon validation, including bench-level electrical measurements and performance analysis.Run structured experiments to fine-tune device parameters while safeguarding long-term reliability.
You are someone who brings precision, resilience, and purpose to everything you do. You thrive in a collaborative, tech-forward environment and are ready to lead work that drives impact and transformation.
We’re looking for someone with:A master’s degree in electrical & electronic engineering or a related field.Strong knowledge of semiconductor device physics with hands-on experience in TCAD simulation, deck development, and calibration.Familiarity with layout design and test structure, plus excellent communication and cross-team collaboration skills.Self-driven and data-minded, with a growth-oriented mindset and strong sense of ownership.
Ready to Precision-Engineer Your Future?Whether you're seeking your next challenge or ready to lead meaningful innovation, UMC is where you can shape what comes next.Lead What’s Next. Apply Now.
About United Microelectronics Corporation
United Microelectronics Corporation (UMC) is a leading global semiconductor foundry with over 40 years of innovation powering technologies across AI, automotive, consumer electronics, connectivity, and IoT. As one of the industry’s most established players, we enable breakthrough technologies through precision-engineered semiconductor manufacturing for customers across every major sector of the electronics world.
Headquartered in Taiwan, UMC has been present in Singapore since 2004 and continues to invest in local talent, technology, and advanced manufacturing. Our recent Fab expansion reflects our long-term commitment to building Singapore as a key hub for semiconductor innovation, and to creating stable, meaningful careers through innovation, teamwork, and progress.
Join a team where your expertise powers real-world innovation. At UMC, you’ll find long-term stability, growth that adapts to your path, and work that drives impact, right down to the nanometre.
Job Responsibilities:Develop novel BCD platform devices.Conduct TCAD device simulations and deck calibration.Design, analyze, and layout device test keys.Perform device bench testing including DC/HV/reliability testing and characterization.Fine-tune devices to ensure on-time delivery and successful reliability qualification.
Required Capabilities:Solid semiconductor device physics and analysis skill, with a focus on bipolar and power devices.Experience in BCD (Bipolar-CMOS-DMOS) device development and characterization is preferred.Hands on experience in TCAD simulation, calibration, layout, and power device bench testing is advantageous.Good communication and teamwork skills to collaborate effectively with the team.Self-motivated and avid learner.
Qualifications:Preferred Master's or Ph.D. degree in Physics or Electrical Engineering.Relevant working experience in BCD development is preferred.Proficient in both oral and written English.
Job SummaryWe are seeking a highly experienced Staff Technology Development Integration Engineer to lead the development and integration of advanced RF-SOI (Radio Frequency Silicon-On-Insulator) semiconductor technologies. This role will drive process integration across modules, enabling high-performance RF devices for applications such as 5G/6G, IoT, and automotive connectivity.
Key ResponsibilitiesLead end-to-end process integration for RF-SOI technology development, from early concept through qualification and production transfer.Define and optimize integration schemes involving FEOL, MOL, and BEOL modules for RF device performance (e.g., switches, LNAs, tuners).Collaborate closely with device engineering, process module teams (lithography, etch, deposition, implant), and design teams to meet RF performance targets (linearity, insertion loss, isolation).Drive yield improvement and defect reduction through systematic failure analysis and data-driven methodologies.Develop and execute DOE (Design of Experiments) to understand process interactions and optimize device characteristics.Own integration-related technical problem solving, including variability, reliability, and parametric issues.Support silicon debug, electrical characterization, and correlation between process parameters and RF performance.Lead cross-functional integration reviews and provide technical direction to junior engineers.Interface with foundry/manufacturing partners for technology transfer and ramp-up.Document and present technical findings to internal stakeholders and leadership.
Required QualificationsPhD or Master’s degree in Electrical Engineering, Materials Science, Physics, or related field.8+ years of semiconductor process integration experience, with strong exposure to RF technologies.Deep understanding of RF-SOI device physics and integration challenges is preferred.Experience with CMOS or SOI process technologies, including integration flows and module interactions.Strong analytical skills with hands-on experience in DOE, statistical analysis, and yield learning.Proven track record of solving complex integration problems in advanced nodes.Familiarity with RF device characterization and key metrics (harmonics, linearity, R_on, C_off, etc.).Excellent communication and leadership skills.
Key CompetenciesTechnical leadership and ownershipCross-functional collaborationData-driven decision makingProblem-solving under ambiguityInnovation in semiconductor technology development
Impact of the RoleThis role is critical in enabling next-generation RF technologies that power modern wireless communication systems. You will directly influence device performance, manufacturability, and time-to-market for cutting-edge semiconductor solutions.
