The Strategy Marketing Analyst proactively gathers and analyzes market data to deliver actionable insights that inform business decisions. This role involves developing a thorough understanding of market size and segmentation, competitive landscape, customer needs, industry trends, and emerging opportunities.
Job ResponsibilitiesCollect, monitor and analyze market data related to industry trends, including regulations, technological trends and market dynamics, analyse customer needs and competitive landscape, to assist in strategic decision-making.Conduct market segmentation and sizing to identify target markets and growth opportunitiesConduct thorough market research to identify opportunities for growth and increased market shareCreate detailed reports and presentations that summarize research findings and provide where possible actionable insights to marketing and management teamsCollaborate with cross-functional teams to support strategic planning and ensure cohesive strategy alignment with business goal.Maintain up-to-date knowledge of the competitive landscape and customer needsSupport the development of marketing strategies through data-driven analysis and recommendationsAny additional duties assigned
Education:Bachelor’s Degree in Business & Economics, Social Science or Marketing or any related field
Job Experience:Minimum 2-4 years of experience in research, data analysis, or a related analytical role preferably in the technological sectorProven experience in market research, financial analysis, business intelligence, or academic research preferred Experience interpreting complex datasets and generating actionable insights to support business decisions Familiarity with sector-specific industry trends and research methodologies is highly desirableDemonstrated ability to collaborate internally and required information from different stakeholdersProficiency in data analysis tools (eg. Excel, Power BI) and experience in CRMStrong critical thinking and problem-solving skillsExcellent communication and presentation skillsSelf-motivated and a team player
Others:Fluent in English, written and verbalProficient in another ASEAN language is preferredExcel in Microsoft office.Self-motivated and a team playerMeticulous and ability to work independentlyPositive spirit and can-do attitudeAbility to multi-task and agilityGood interpersonal and collaborative skills
Electrical Solution Architect role focuses on the design and optimization of power infrastructure for co-location and hyperscale data centers. The ideal candidate will have a strong background in electrical infrastructure, redundancy planning, and power efficiency for factory-tested solutions that seamlessly integrate into hyperscale environments.
Joining the regional solution architect team the candidate will be required to contribute with knowledge and experience on the whole life cycle of large-scale data center projects including calculations and evaluation, concept and detailed design, procurement, implementation, testing, commissioning, and operation.
As part of this role, it is required to provide technical support to internal and external stakeholders including engineering, manufacturing, operation, and service teams as well as clients. This individual will be expected to have and maintain a high level of technical electrical and cooling knowledge as well as relevant products and their application within the telecom and data center industry. For this position it is required to be fully versed in local and international standards as well as industry best practices.
ResponsibilitiesElectrical Design & Modular Power Architecture:Developing prefabricated, plug-and-play electrical solutions, including modular substations, UPS and battery systems, and high-efficiency power distribution to enable rapid deployment at a global scale.Ensure seamless integration between modular units and on-site electrical infrastructure.Energy Efficiency:Optimize Power Usage Effectiveness (PUE) using high-efficiency power conversion, optimum power and cooling distribution, and effective monitoring in provided solutions.Design energy management solutions for automated power distribution, fault detection, and predictive maintenance.Compliance & Standards:Ensure adherence to applicable local and international codes and standards relevant to hyperscale-specific electrical infrastructure.Work with regulatory bodies/authorized testing laboratories to certify prefabricated electrical modules for hyperscale data center deployments.Stakeholder Engagement:Collaborate with hyperscale cloud providers, EPC firms, product line, and modular infrastructure suppliers to develop tailored solutions.Engage with OEMs and supply chain partners to ensure optimal selection of 3rd party products.Support sales and business development teams by providing technical expertise in RFPs, proposals, and solution customization.Deployment & Lifecycle Management:Oversee factory acceptance testing (FAT), site commissioning, and integration testing for modular power solutions.Implement predictive maintenance strategies for prefabricated power modules.Provide technical training to client operation team, partners, as well as internal service teams on provided solutions.Documentation:Review the product documents including drawings, specifications, manuals, brochures, etc. and provide comments on improvements.Prepare solution design documents including drawings, specifications, manuals, and training materials. Provide functional description and SOO (Sequence of Operation) documents in collaboration with client and product teams.Prepare technical presentation on provided solutions with adequate information and present to the client representative(s).Technical Support:Review the tender specifications and provide the best solutions fits the requirements based on the available internal and 3rd party products.Provide compliance statements on provided solutions and prepare deviations list.Review overall technical package for tender submission.Provide technical advisory support to site and service teams during the installation, commissioning, and operation stages as required.Provide responses to technical queries from the client on products and solutions provided with the help and support from internal and external experts according to the local and international regulations and industry best practices.Market intelligence and Product development:Provide market information and technical support on developing company products portfolio including guidelines for R&D team on new product features, future client requirements, local market research, etc.Review competitions products and solutions and provide technical comparison on advantages and disadvantages of company solutions.
Authorities:Review, validation and approval of:client tender specifications and compliance statementproject design documents3rd party contractors’ scope and technical specificationsproduct selection for projectsnew product developmentmarket innovations and competitors
Experience & Requirements:Required: Bachelor’s or Master’s degree in Electrical, Power, or Electronic EngineeringMinimum 8 years of experience in power infrastructure design for data centers, telecommunication, and/or mission critical projects.Fluent in English speaking and writingVast experience with DC and AC critical power products and systems including prefabricated and modular solutionsSolid understanding of international standards, regional building codes, fire codes, and other industry relevant codes and best practices (e.g. IEEE, NEC, IEC, EN, NFPA, ASHRAE, Uptime Institute, TIA, CIBSE, BCA, NCC, BOMBA, etc.)Expertise in medium voltage (MV) and low voltage (LV) power distributionExperienced with UPS topologies, battery systems, and integrationKnowledge of SCADA, DCIM, and power/energy management platformsFluent in AutoCAD and VisioProficiency in MS OfficeExcellent technical report writing and presentation skills
Desired:Familiar with data center tier classifications.Mandarin / Thai speakingUnderstanding business and financial terms such as Capex, Opex, TCO, ROI, ROA, etc. and ability to apply them to solutions.Uptime Institute AccreditationCertified Data Center Professional (CDCP)ETAP, PowerCAD, or similar toolsOther industry accreditation
Others:Personal skills (traits, attributes):Strong verbal and written communication Problem-solving and analytical thinkingTeam player with a consultative styleAbility to conduct presentations for different audiencesExcellent relationship management skillsGood time management and organizational skillsThis role requires international travel in South-East Asia (SEA) region
Structural Solution Architect role focuses on the structural integrity, transportability, andscalability of modular prefabricated solutions for co-location and hyperscale data centers.The ideal candidate will have a strong background in structural design and optimization ofcontainerized power and cooling systems ensuring they meet operational, environmental,safety and security, and compliance requirements. Joining the regional solution architect team the candidate will collaborate with cross- functional teams, including mechanical, electrical, and manufacturing engineers, to deliver high-performance, rapidly deployable data center solutions.As part of this role, it is required to provide technical support to internal and externalstakeholders including engineering, manufacturing, operation, and service teams as wellas clients.
This individual will be expected to have and maintain a high level of technical mechanicaland structural knowledge as well as understanding of relevant products and theirapplication within the data center industry. For this position it is required to be fully versed in local and international standards as well as industry best practices. Responsibilities:Structural Design & Modular Architecture:Design and develop containerized / modular power train systems that integrate power, cooling, and IT infrastructure in prefabricated enclosures.Ensure structural designs support transportability, stacking, and deployment in diverse environments, including remote and high-risk locations.Optimize frame structures, load-bearing capacities, and seismic resistance for shipping and on-site installation.Define mounting and reinforcement solutions for heavy electrical equipment, including generators, transformers, switchgear, UPS, and cooling units.Risk Management & Durability Enhancements:Conduct seismic risk assessments, wind load analysis, and thermal expansion studies for containerized solutions.Design for shock absorption, vibration damping, and weatherproofing to ensure operational reliability in extreme conditions.Implement fire resistance, blast-proofing, and EMI shielding according to local requirements and regulations.Compliance & Standards:Ensure adherence to applicable local and international codes and standards and building codes relevant to hyperscale-specific structural design.Work with regulatory bodies and obtain necessary permits, certificates, and approvals.Stakeholder Engagement:Coordinate with mechanical, electrical, and IT teams to integrate infrastructure seamlessly.Work with vendors and construction teams to select structural materials and components and ensure coordination and integration on site.Colaborate with manufacturers, suppliers, and logistics teams to ensure cost effective fabrication, assembly, and transport.Present and justify structural design decisions to senior leadership and stakeholders.Support sales and business development teams by providing technical expertise in RFPs, proposals, and solution customization.Deployment & Lifecycle Management:Oversee the manufacturing and assembly process of containerized power train and other modular units, ensuring structural quality control.Develop installation guidelines and best practices for on-site deployment, stacking, and expansion.Support retrofit and upgrade strategies for existing modular power units to enhance longevity and performance.Documentation:Provide the solution documents including drawings, specifications, manuals, brochures, rigging and handling, etc. Review and contribute to other functions / teams documents as required.Prepare technical presentation on provided solutions with adequate information and present to the client representative(s).Technical Support:Review the tender specifications and provide the best solutions fits the requirements.Provide compliance statements on provided solutions and prepare deviations list.Review overall technical package for tender submission.Provide technical advisory support to site and service teams during the installation, commissioning, and operation stages as required.Provide responses to clients’ technical queries on products and solutions provided according to the local and international regulations and industry best practices.Provide support for required certifications for each solution according to local authorities requirements.Market intelligence and Product development:Provide market information and technical support on developing company products portfolio including guidelines for R&D team on new product features, future client requirements, local market research, etc.Review competitions products and solutions and provide technical comparison on advantages and disadvantages of company solutions.
Authorities:Review, validation and approval of:client tender specifications and compliance statementproject design documents3rd party contractors scope and technical specificationsmaterial selection for projectsmarket innovations and competitors analysis
Qualifications & Requirements:Required:Bachelor’s or Master’s degree in Mechanical or Structural EngineeringMinimum 8 years of experience in structural design, construction, and risk analysis for mission critical projects.Solid understanding of international standards, regional building codes, fire codes, and other industry relevant codes and best practices (e.g. IBC, BCA, NCC, ASCE, ISO, NEC, SCDF, BOMBA, etc.)Fluent in English speaking and writingExpertise in steel structures, chassis design, and stress analysis.Proficiency with Finite Element Analysis (FEA), structural simulation, and 3D modeling tools (e.g. SAP2000, STAAD.Pro, SolidWorks).Strong knowledge of ISO container standards, wind/seismic load calculations, and foundation anchoring.Familiarity with fire-resistant materials, thermal insulation, and corrosion protection.Experience with BIM (Building Information Modeling) and CAD software.Proficiency in MS Office and excellent technical report writing skills
DesiredLocal / regional certification licenseUnderstanding of logistic and transportation standards, codes, and terms for regional deployment.Familiar with individual countries local codes and approval / certification process.Familiar with data center tier classifications.
Others:Personal skills (traits, attributes):Strong verbal and written communication Problem-solving and analytical thinkingTeam player with a consultative styleAbility to conduct presentations for different audiencesExcellent relationship management and project leadership skillsGood time management and organizational skillsThis role requires international travel in South-East Asia (SEA) region.
About Silicon Photonics Business DivisionDelta Silicon Photonics Business Division develops world-class silicon photonics chips and solutions that power next-generation sensors and intelligent systems. Our mission is to deliver smarter and safer environments — from machines and infrastructure to everyday life — by translating advanced silicon photonics into real-world impact that benefits people. We are a future-focused, innovative, and entrepreneurial team driven by deep technology expertise, bold execution, and a strong sense of purpose.
What You’ll Be DoingAs a Principal Scientist for Photonic-Electronic Co-Design & Packaging, you will be the visionary architect responsible for the physical and functional convergence of our most advanced integrated systems. This is a high-impact role where you will explore the scientific boundaries of how light and electronics interact at the chip scale.You will move beyond traditional packaging to pioneer multi-domain co-design, solving fundamental physics challenges such as thermal-mechanical stress in 3D stacks, high-speed signal integrity in silicon interposers, and the optimization of high-density photonic-electronic interfaces. Your work will define the blueprint for our future sensor engines, ensuring they are not only scalable but represent the state-of-the-art in heterogeneous integration.
What It’s Like Working With UsYou’ll work in a highly technical, fast-moving environment where problems are complex and solutions are not always predefined. Collaboration is essential across engineering, product, operations, and supply-chain teams, and progress depends on clear thinking, trust, and ownership.We value curiosity and continuous learning, and we expect team members to be comfortable navigating ambiguity, testing assumptions, and improving through iteration. People here are encouraged to take initiative, learn quickly from both successes and setbacks, and shape how work gets done.
Key Technical ResponsibilitiesScientific Architecture of Multi-Chip Systems: Lead the conceptual and physical architecture of massive high-I/O systems (500 to 10,000+ channels). You will develop the scientific framework for PIC-EIC co-integration, optimizing for signal fidelity, power density, and optical alignment stability.Advanced Integration Research: Drive the research and implementation of next-generation interconnect technologies. You will serve as the technical authority on the application of TSVs, Hybrid Bonding, and Silicon/Glass Interposers, evaluating the physical trade-offs of each for coherent sensing applications.Co-Optimization of Photonic-Electronic Interfaces: Partner with design scientists to establish new paradigms for high-speed electrical interconnects and waveguide layouts. You will ensure that the physical implementation preserves the integrity of coherent optical signals while managing the electromagnetic complexities of high-density electronic routing.Cross-Functional Technical Synthesis: Act as the bridge between theoretical optics and microelectronic implementation. You will translate system-level physics requirements into rigorous physical design rules, ensuring that the sensor's optical performance is enhanced, not hindered, by its packaging.Strategic Supplier & Foundry Collaboration: Technical leadership in qualifying OSAT and Foundry partners for emerging assembly technologies. You will lead Design-for-Manufacturing (DfM) and Design-for-Test (DfT) from a scientific perspective, ensuring that new integration methods are robust enough for commercial scaling.
Required Technical QualificationsEducation: Ph.D. in Electrical Engineering, Applied Physics, Photonics, or Materials Science with a focus on advanced semiconductor integration.Core Scientific Expertise:Significant experience (7+ years preferred) in advanced packaging research or complex heterogeneous system co-design.Deep understanding of the physics of high-density interconnects (≥500 I/O) and the mechanical/thermal implications of 2.5D and 3D integration.Strong background in Silicon Photonics (SiPh), specifically regarding how packaging materials and processes affect optical phase stability and propagation loss.Modelling & Simulation Skills:Familiarity with si photonics design and simulations. Expertise in analysing signal integrity (SI) and power integrity (PI) at the chip-package interface.Familiarity with thermal-mechanical co-simulation and its impact on photonic device performance.Familiarly with optical subassembly and packaging.Software Proficiency: Mastery of photonics simulation tools (e.g., Lumerical) and IC layout environments.Mastery of IC and packaging layout environments (e.g., Cadence Virtuoso, Allegro X Advanced Package Designer, or similar advanced 3D-IC tools).
About Silicon Photonics Business DivisionDelta Silicon Photonics Business Division develops world-class silicon photonics chips and solutions that power next-generation sensors and intelligent systems. Our mission is to deliver smarter and safer environments — from machines and infrastructure to everyday life — by translating advanced silicon photonics into real-world impact that benefits people. We are a future-focused, innovative, and entrepreneurial team driven by deep technology expertise, bold execution, and a strong sense of purpose.
What You’ll Be DoingAs a Scientist for PIC Process & Integration, you will be the primary technical authority bridging our internal sensor designs with external high-volume manufacturing partners. You will lead the technical strategy for Chip Integration and Advanced Packaging, ensuring that our proprietary photonic and electronic designs are seamlessly integrated into robust, high-performance sensor engines.Your role is to translate product-level requirements into manufacturable architectures. You will drive deep technical collaborations with Silicon Photonics foundries and OSAT partners, navigating the complex trade-offs between design innovation and fabrication reality to bring next-generation coherent sensing solutions to life.
What It’s Like Working With UsYou’ll work in a highly technical, fast-moving environment where problems are complex and solutions are not always predefined. Collaboration is essential across engineering, product, operations, and supply-chain teams, and progress depends on clear thinking, trust, and ownership.We value curiosity and continuous learning, and we expect team members to be comfortable navigating ambiguity, testing assumptions, and improving through iteration. People here are encouraged to take initiative, learn quickly from both successes and setbacks, and shape how work gets done.
Key ResponsibilitiesCross-Functional Product Integration & DfX: Serve as the lead technical authority bridging PIC/EIC Design and Product Engineering through the lens of Chip Integration and Advanced Packaging. Proactively drive Design-for-Manufacturing (DfM), Assembly (DfA), and Reliability (DfR) initiatives, ensuring architectural innovations are compatible with high-volume packaging constraints. Define clear technical trade-offs early in the design cycle to ensure the final sensor engine achieves product-level performance, thermal stability, and cost-efficiency.Chip Integration and Advanced Packaging Strategy: Lead the architectural definition and assembly flow development for PIC-EIC integration. Collaborate with OSAT partners to solve fundamental challenges in high-density interconnects, thermal management, and mechanical reliability for high-pin-count packages.Foundry Co-development & PDK Steering: Drive technical partnerships with Silicon Photonics foundries to customize PDK (Process Design Kit) components. Optimize device geometries—such as Strip and Rib waveguides—to ensure phase stability and low propagation loss essential for coherent sensing.External Process Control & DfM: Define and monitor Process Control Monitor (PCM) parameters and fabrication tolerances to ensure manufacturing variances remain within the limits of the overall system link budget.Yield & Metrology Strategy: Establish technical protocols for wafer-level optical probing and Known Good Die (KGD) verification to ensure high-performance reliability across the integrated assembly.
QualificationsEducation: Ph.D. in Physics, Optics, Photonics, Electrical Engineering, or a related field focusing on Integrated Photonics or Microelectronics.Core Optics & Silicon Photonics Expertise:Strong theoretical and practical background in Classical Optics and Photonics, including wave optics, interference, and laser physics.Deep technical background in Silicon Photonics (SiPh) device physics, including passive and active component design (waveguides, phase shifters, photodetectors).Extensive experience in SiPh fabrication processes and hands-on familiarity with foundry PDK structures and design rules.
Manufacturing & Integration Experience:Significant experience in a Fabless environment managing technical interfaces with Foundry (Front-end) and OSAT (Back-end) partners.Proven track record in Advanced Packaging Development, specifically for high-performance heterogeneous integration (e.g., Flip-Chip, 2.5D, or 3D architectures).Strong understanding of Coherent Detection principles and the impact of fabrication variances on optical-electrical signal integrity.Software Proficiency: Mastery of photonics simulation tools (e.g., Lumerical) and IC layout environments.Mastery of IC and packaging layout environments (e.g., Cadence Virtuoso, Allegro X Advanced Package Designer, or similar advanced 3D-IC tools).
